標題: Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
作者: Liang, S. W.
Chang, Y. W.
Shao, T. L.
Chen, Chih
Tu, K. N.
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 10-Jul-2006
摘要: Effect of three-dimensional current distribution on void formation in flip-chip solder joints during electromigration was investigated using thermoelectrical coupled modeling, in which the current and temperature redistributions were coupled and simulated at different stages of void growth. Simulation results show that a thin underbump metallization of low resistance in the periphery of the solder joint can serve as a conducting path, leading to void propagation in the periphery of the low current density region. In addition, the temperature of the solder did not rise significantly until 95% of the contact opening was eclipsed by the propagating void. (c) 2006 American Institute of Physics.
URI: http://dx.doi.org/10.1063/1.2220550
http://hdl.handle.net/11536/12032
ISSN: 0003-6951
DOI: 10.1063/1.2220550
期刊: APPLIED PHYSICS LETTERS
Volume: 89
Issue: 2
結束頁: 
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