|標題:||Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes|
|作者:||Chang, Y. W.|
Liang, S. W.
Department of Materials Science and Engineering
|摘要:||Kelvin bump probes were fabricated in flip-chip solder joints, and they were employed to monitor the void formation during electromigration. We found that voids started to form at approximately 5% of the failure time under 0.8 A at 150 degrees C, and the bump resistance increased only 0.02 m Omega in the initial stage of void formation. Three-dimensional simulation was performed to examine the increase in bump resistance at different stages of void formation, and it fitted the experimental results quite well. This technique provides a systematic way for investigating the void formation during electromigration. (c) 2006 American Institute of Physics.|
|期刊:||APPLIED PHYSICS LETTERS|
|Appears in Collections:||Articles|
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