標題: Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
作者: Chang, Y. W.
Liang, S. W.
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 17-Jul-2006
摘要: Kelvin bump probes were fabricated in flip-chip solder joints, and they were employed to monitor the void formation during electromigration. We found that voids started to form at approximately 5% of the failure time under 0.8 A at 150 degrees C, and the bump resistance increased only 0.02 m Omega in the initial stage of void formation. Three-dimensional simulation was performed to examine the increase in bump resistance at different stages of void formation, and it fitted the experimental results quite well. This technique provides a systematic way for investigating the void formation during electromigration. (c) 2006 American Institute of Physics.
URI: http://dx.doi.org/10.1063/1.2226989
http://hdl.handle.net/11536/12020
ISSN: 0003-6951
DOI: 10.1063/1.2226989
期刊: APPLIED PHYSICS LETTERS
Volume: 89
Issue: 3
結束頁: 
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