標題: A wafer-level hermetic encapsulation for MEMS manufacture application
作者: Liang, Zhi-Hao
Cheng, Yu-Ting
Hsu, Wensyang
Lee, Yuh-Wen
機械工程學系
電子工程學系及電子研究所
Department of Mechanical Engineering
Department of Electronics Engineering and Institute of Electronics
關鍵字: acceleration tests;driven-out spin method;hermetic encapsulation;low-temperature wafer bonding;microelectromechanical systems (MEMS) manufacturing;post-process;ultraviolet (UV) adhesive;wafer-level packaging
公開日期: 1-八月-2006
摘要: In order to simplify the processing complexity and cut down the manufacturing cost, a new wafer bonding technique using ultraviolet (UV) curable adhesive is introduced here for microelectromechanical systems (MEMS) device packaging and manufacturing applications. UV curable adhesive is cured through UV light exposure without any heating process that is suitable for the packaging of temperature-sensitive materials or devices. A Pyrex 7740 glass is chemically wet etched to form microcavities and utilized as the protection cap substrate. After a UV-curable adhesive is spin-coated onto the glass substrate, the substrate is then aligned and bonded through UV light exposure with a device substrate below. Electrical contact pad opening and die separation are done simultaneously by dicing. Two different testing devices, a dew point sensor and capacitive accelerometer, are built to evaluate the package strength and hermeticity. After the dicing process, no structural damage or stiction phenomenon is found in the packaged parallel capacitor. The acceleration test results also indicate that the package using the Loctite 3491 UV adhesive with 150 mu m bond width can survive more than 300 days at a 25 degrees C and 100% relative humidity working environment.
URI: http://dx.doi.org/10.1109/TADVP.2006.875092
http://hdl.handle.net/11536/11965
ISSN: 1521-3323
DOI: 10.1109/TADVP.2006.875092
期刊: IEEE TRANSACTIONS ON ADVANCED PACKAGING
Volume: 29
Issue: 3
起始頁: 513
結束頁: 519
顯示於類別:期刊論文


文件中的檔案:

  1. 000239707900017.pdf