|Title:||Cu/CuMg gate electrode for the application of hydrogenated amorphous silicon thin-film transistors|
|Authors:||Wang, M. C.|
Li, Y. Y.
Xiao, R. W.
Lin, L. F.
Chen, J. R.
Department of Photonics
Institute of Display
|Abstract:||The feasibility of using Cu/CuMg as a gate electrode for a-Si:H thin-film transistors (TFTs) has been investigated in this work. The issue of adhesion between the Cu film and glass substrates has been overcome by introducing the Cu/CuMg alloy. Furthermore, a wet-etching process of Cu-based gate metal has been proposed by using the copper etchant in the conventional printed circuit boards. The experimental result showed superior performance of a-Si:H TFT with desired electrode taper angle and minimal loss of critical dimension. The a-Si:H TFT exhibited mobility of 0.37 cm(2)/V s, subthreshold slope of 0.83 V/dec, and V(th) of 2.02 V.|
|Journal:||ELECTROCHEMICAL AND SOLID STATE LETTERS|
|Appears in Collections:||Articles|