標題: Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
作者: Liang, S. W.
Chiu, S. H.
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 19-Feb-2007
摘要: This study investigates the mechanism for the abrupt increase in temperature at later stages of electromigration in flip-chip solder joints. It is found that electromigration also occurs in Al traces when stressed by 0.6 A at 100 degrees C. Three-dimensional thermoelectrical simulation by finite element analysis was carried out to simulate the temperature distribution in solder joints with and without degradation of the Al trace. It is found that the degradation of the Al trace has substantial effect on the Joule heating of solder joints. This model can explain the serious Joule heating effect in the later stages of electromigration. (c) 2007 American Institute of Physics.
URI: http://dx.doi.org/10.1063/1.2644061
http://hdl.handle.net/11536/11118
ISSN: 0003-6951
DOI: 10.1063/1.2644061
期刊: APPLIED PHYSICS LETTERS
Volume: 90
Issue: 8
結束頁: 
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