標題: Illumination system for wire bonding inspection
作者: Perng, Der-Baau
Chou, Cheng-Chuan
Lee, Shu-Ming
工業工程與管理學系
Department of Industrial Engineering and Management
公開日期: 20-Feb-2007
摘要: A novel lighting system was devised for 3D defect inspection in the wire bonding process. Gold wires of 20 mu m in diameter were bonded to connect the integrated circuit (IC) chip with the substrate. Bonding wire defects can be classified as 2D type and 3D type. The 2D-type defects include missed, shifted, or shorted wires. These defects can be inspected from a 2D top-view image of the wire. The 3D-type bonding wire defects are sagging wires, and are difficult to inspect from a 2D top-view image. A structured lighting system was designed and developed to facilitate all 2D-type and 3D-type defect inspection. The devised lighting system can be programmed to turn the structured LEDs on or off independently. Experiments show that the devised illumination system is effective for wire bonding inspection and will be valuable for further applications.
URI: http://dx.doi.org/10.1364/AO.46.000845
http://hdl.handle.net/11536/11113
ISSN: 0003-6935
DOI: 10.1364/AO.46.000845
期刊: APPLIED OPTICS
Volume: 46
Issue: 6
起始頁: 845
結束頁: 854
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