標題: Design of low-temperature CMOS-process compatible membrane fabricated with sacrificial aluminum layer for thermally isolated applications
作者: Chang, Kow-Ming
Lin, Ren-Jie
Deng, I-Chung
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: sacrificial layer;residual stress;sticking effect;surface micromachining;anchor profile
公開日期: 15-Mar-2007
摘要: In the surface micromachining technique, residual stress and sticking effect play an important role in determining whether a microstructure is suspended or collapse during a release process. In this paper, we propose a simpler method for making suspended membranes for thermally isolated application by using cheap processing steps and compatible with CMOS-process; also, there are some simulations done to predict stiction as function of the anchor profile. It is demonstrated by fabricating the test structures of CMOS-process compatible surface micromachined bolometer using aluminum sacrificial layer with high yield and high throughput. The aluminum sacrificial layer provides some benefits including rapid wet-etching and high wet-etching selectivity with respect to dielectric materials. The residual stress and gravity of the microstructures are evaluated with structural simulations, and the sticking effect can be alleviated by an appropriate structure design and a release process. Once the residual stress is known, we can successfully use Coventorware simulations to predict a suspended membrane by controlling the anchor profile which contains sidewall conformal factor and sidewall angle. The simulation results are in good agreement with the experiments. (c) 2006 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.sna.2006.02.053
http://hdl.handle.net/11536/11028
ISSN: 0924-4247
DOI: 10.1016/j.sna.2006.02.053
期刊: SENSORS AND ACTUATORS A-PHYSICAL
Volume: 134
Issue: 2
起始頁: 660
結束頁: 667
Appears in Collections:Articles


Files in This Item:

  1. 000245319900048.pdf