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dc.contributor.authorHsieh, Kun-Linen_US
dc.contributor.authorTong, Lee-Ingen_US
dc.contributor.authorWang, Min-Chiaen_US
dc.date.accessioned2014-12-08T15:14:22Z-
dc.date.available2014-12-08T15:14:22Z-
dc.date.issued2007-04-01en_US
dc.identifier.issn0957-4174en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.eswa.2006.01.050en_US
dc.identifier.urihttp://hdl.handle.net/11536/10970-
dc.description.abstractc-Chart was frequently used to monitor wafer defects during IC manufacturing. The clustering degree of defect on a wafer will increase along with the area of wafer gradually enlarging. The defect clustering causes the Poisson-based c-chart to exhibit many false alarms. Although several revised control charts have been developed to reduce the number of false alarms, those control charts still have some disadvantages in practical use. This study proposes a control chart that applies fuzzy theory and engineering experience to monitor wafer defects with the consideration of defect clustering. The proposed control chart is simpler and more rational than those revised c-charts. Finally, a case study of an IC company, owing to the HsinChu Scientific part at Taiwan, is used to demonstrate and verify the rationality and effectiveness. (C) 2006 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectintegrated circuits (IC)en_US
dc.subjectcontrol charten_US
dc.subjectdefect clusteringen_US
dc.subjectfuzzy theoryen_US
dc.titleThe application of control chart for defects and defect clustering in IC manufacturing based on fuzzy theoryen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.eswa.2006.01.050en_US
dc.identifier.journalEXPERT SYSTEMS WITH APPLICATIONSen_US
dc.citation.volume32en_US
dc.citation.issue3en_US
dc.citation.spage765en_US
dc.citation.epage776en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000243799100004-
dc.citation.woscount17-
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