標題: Thermomigration in flip-chip SnPb solder joints under alternating current stressing
作者: Hsiao, Hsiang-Yao
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 9-Apr-2007
摘要: Thermomigration in flip-chip solder joints is investigated using alternating currents and infrared microscopy to decouple it from electromigration effect. It is found that the thermal gradient in solder bump can be as high as 2143 degrees C/cm when 9.2x10(4) A/cm(2) was applied at 100 degrees C. Markers fabricated by focus ion beam are employed to measure the thermomigration rate. The thermomigration flux is measured to be 3.3x10(13) at./cm(2). With the known thermal gradient, the molar heat of 26.8 kJ/mole has been obtained for the transport of Pb. (c) 2007 American Institute of Physics.
URI: http://dx.doi.org/10.1063/1.2721136
http://hdl.handle.net/11536/10920
ISSN: 0003-6951
DOI: 10.1063/1.2721136
期刊: APPLIED PHYSICS LETTERS
Volume: 90
Issue: 15
結束頁: 
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