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dc.contributor.authorWang, Chih-Fengen_US
dc.contributor.authorChiou, Shih-Fengen_US
dc.contributor.authorKo, Fu-Hsiangen_US
dc.contributor.authorChen, Jem-Kunen_US
dc.contributor.authorChou, Cheng-Tungen_US
dc.contributor.authorHuang, Chih-Fengen_US
dc.contributor.authorKuo, Shiao-Weien_US
dc.contributor.authorChang, Feng-Chihen_US
dc.date.accessioned2014-12-08T15:14:01Z-
dc.date.available2014-12-08T15:14:01Z-
dc.date.issued2007-05-22en_US
dc.identifier.issn0743-7463en_US
dc.identifier.urihttp://dx.doi.org/10.1021/la062921een_US
dc.identifier.urihttp://hdl.handle.net/11536/10786-
dc.description.abstractOne of the most important tasks remaining to be resolved in nanoimprint lithography is the elimination of the resist sticking to the mold during demolding. Previously, the main approach was to apply a thin layer of fluorinated alkyl silane mold-release agent on the surface on the mold; however, this involves complicated steps and high costs. The low surface free energy material polybenzoxazine provides an efficient mold-release agent for silicon molds that is easier to process, costs less, and has no side reactions.en_US
dc.language.isoen_USen_US
dc.titlePolybenzoxazine as a mold-release agent for nanoimprint lithographyen_US
dc.typeArticleen_US
dc.identifier.doi10.1021/la062921een_US
dc.identifier.journalLANGMUIRen_US
dc.citation.volume23en_US
dc.citation.issue11en_US
dc.citation.spage5868en_US
dc.citation.epage5871en_US
dc.contributor.department材料科學與工程學系奈米科技碩博班zh_TW
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentGraduate Program of Nanotechnology , Department of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.identifier.wosnumberWOS:000246456700007-
dc.citation.woscount33-
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