標題: Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]
作者: Hsiao, Hsiang-Yao
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 11-Jun-2007
URI: http://dx.doi.org/10.1063/1.2748851
http://hdl.handle.net/11536/10692
ISSN: 0003-6951
DOI: 10.1063/1.2748851
期刊: APPLIED PHYSICS LETTERS
Volume: 90
Issue: 24
結束頁: 
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