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dc.contributor.authorLin, Shih-Pingen_US
dc.contributor.authorLee, Chung-Lenen_US
dc.contributor.authorChen, Jwu-Een_US
dc.contributor.authorChen, Ji-Janen_US
dc.contributor.authorLuo, Kun-Lunen_US
dc.contributor.authorWu, Wen-Chingen_US
dc.date.accessioned2014-12-08T15:13:46Z-
dc.date.available2014-12-08T15:13:46Z-
dc.date.issued2007-07-01en_US
dc.identifier.issn1063-8210en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TVLSI.2007.899232en_US
dc.identifier.urihttp://hdl.handle.net/11536/10646-
dc.description.abstractThe random-like filling strategy pursuing high compression for today's popular test compression schemes introduces large test power. To achieve high compression in conjunction with reducing test power for multiple-scan-chain designs is even harder and very few works Were dedicated to solve this problem. This paper proposes and demonstrates a multilayer data copy (MDC) scheme for test compression as well as test power reduction for multiple-scan-chain designs. The scheme utilizes,a decoding buffer, which supports fast loading using previous loaded data, to achieve test data compression and test power reduction at the same time. The scheme can be applied automatic test pattern generation (ATPG)-independently or to be incorporated in an ATPG to generate highly compressible and power efficient test sets. Experiment results on benchmarks show that test sets generated by the scheme had large compression and power saving with only a small area design overhead.en_US
dc.language.isoen_USen_US
dc.subjectcircuit testingen_US
dc.subjectlow-power testingen_US
dc.subjecttest data compressionen_US
dc.subjecttest pattern generationen_US
dc.titleA multilayer data copy test data com pression scheme for reducing shifting-in power for multiple scan designen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TVLSI.2007.899232en_US
dc.identifier.journalIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMSen_US
dc.citation.volume15en_US
dc.citation.issue7en_US
dc.citation.spage767en_US
dc.citation.epage776en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000247644700004-
dc.citation.woscount13-
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