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dc.contributor.authorWei, Kung-Hwaen_US
dc.contributor.authorLeu, Chyi-Mingen_US
dc.date.accessioned2014-12-16T06:16:13Z-
dc.date.available2014-12-16T06:16:13Z-
dc.date.issued2006-06-08en_US
dc.identifier.govdocC08G077/04zh_TW
dc.identifier.govdocC08G077/455zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105705-
dc.description.abstractPolyhedral oligomeric silsesquioxane/polyimide nanocomposites with certain mechanical properties and low dielectric constant is synthesized by covalently tethering functionalized polyhedral oligomeric silsesquioxane molecules to polyimide. These nanocomposites appear to be self-assembled systems. A process for synthesizing said polyhedral oligomeric silsesquioxane/polyimide nanocomposites also is provided, comprising a step of forming porous type polyhedral oligomeric silsesquioxane, and a subsequent step of reacting with dianhydride or directly reacting with synthesized polyimide.zh_TW
dc.language.isozh_TWen_US
dc.titleConvalently bonded polyhedral oligomeric silsesquioxane/polyimide nanocomposites and process for synthesizing the samezh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20060122350zh_TW
Appears in Collections:Patents


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