標題: Cu-metalized compound semiconductor device
作者: Chang, Edward Yi
Chang, Shang-Wen
Lee, Cheng-Shih
公開日期: 28-Dec-2006
摘要: The present invention is a compound semiconductor device characterized in that it is Cu-metalized to improved the reliability of the device and to greatly reduce the cost of production.
官方說明文件#: H01L021/8238
H01L027/082
URI: http://hdl.handle.net/11536/105677
專利國: USA
專利號碼: 20060292785
Appears in Collections:Patents


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  1. 20060292785.pdf