標題: Design and development of a new machine vision wire bonding inspection system
作者: Perng, Der-Baau
Chou, Cheng-Chuan
Lee, Shu-Ming
工業工程與管理學系
Department of Industrial Engineering and Management
關鍵字: machine vision;wire bonding inspection;lighting environment
公開日期: 1-Sep-2007
摘要: In this paper, we developed a fast and robust machine vision system for wire bonding inspection. The defects caused by a bonding wire being broken, lost, shifted, shorted, or sagged in an integrated circuit (IC) chip can be inspected automatically. A new lighting environment was devised which will highlight the slope of the bonding wire and suppress the background from being extracted. First, a set of machine vision algorithms were designed to filter out the defects of broken wire, lost wire, shifted wire, and shorted-out wire. Second, the 3-D type defect of sagged wire can be detected by inspecting the change of the bonding wire slope, derived from a single 2-D image. Some illustrations are given to show the efficiency and effectiveness of the proposed novel wire bonding vision inspection system.
URI: http://dx.doi.org/10.1007/s00170-006-0611-6
http://hdl.handle.net/11536/10410
ISSN: 0268-3768
DOI: 10.1007/s00170-006-0611-6
期刊: INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Volume: 34
Issue: 3-4
起始頁: 323
結束頁: 334
Appears in Collections:Articles


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