標題: Relieving hot-spot temperature during electromigration in solder and current crowding effects bumps by using Cu columns
作者: Liang, S. W.
Chang, Y. W.
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: electromigration;flip-chip solder joints;Joule heating
公開日期: 1-Oct-2007
摘要: Solder joints with Cu columns appear to be one of the best structures to resist electromigration. Three-dimensional thermoelectrical analysis was employed to simulate the current density and temperature distributions for eutectic SnPb solder bumps with 0.5, 5, 25, 50, and 100 mu m Cu under bump metallization (UBM). It was found that the hot spots and current crowding effects in the solder were reduced significantly when the Cu thickness was over 50 Pm, whereas the overall Joule heating effect remained almost unchanged. The mechanism by which the Cu column is effective in relieving the hot spot and current crowding effects is to keep the solder away from the heat source and crowding region. Simulated at a current of 0.6 A and 70 degrees C, the estimated mean time to failure of the joints with a 50-mu m-thick Cu column was 6.7 times longer than that of joints with a 0.5-mu m-thick Cu UBM.
URI: http://dx.doi.org/10.1007/s11664-007-0232-3
http://hdl.handle.net/11536/10270
ISSN: 0361-5235
DOI: 10.1007/s11664-007-0232-3
期刊: JOURNAL OF ELECTRONIC MATERIALS
Volume: 36
Issue: 10
起始頁: 1348
結束頁: 1354
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