Title: 60GHz broadband 0/1-level RF-via interconnect for RF-MEMS packaging
Authors: Wu, Wc.
Hsu, L. H.
Chang, E. Y.
Starski, J. P.
Zirath, H.
Department of Materials Science and Engineering
Issue Date: 25-Oct-2007
Abstract: The RF-via interconnect structure front the 0- to the 1-level package for coplanar RF-MEMS devices packaging is evaluated. The 0/1-level interconnect structure was designed and optimised using the electromagnetic simulation tool. The structure was then successfully fabricated and characterised up to 67 GHz. The measured and simulated results show good agreement, demonstrating DC-to-60 GHz broadband interconnect performance through the two levels package with return loss below 15 dB and insertion loss within 0.6 dB.
URI: http://dx.doi.org/10.1049/el:20072083
ISSN: 0013-5194
DOI: 10.1049/el:20072083
Volume: 43
Issue: 22
Begin Page: 1203
End Page: 1205
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