|標題:||60GHz broadband 0/1-level RF-via interconnect for RF-MEMS packaging|
Hsu, L. H.
Chang, E. Y.
Starski, J. P.
Department of Materials Science and Engineering
|摘要:||The RF-via interconnect structure front the 0- to the 1-level package for coplanar RF-MEMS devices packaging is evaluated. The 0/1-level interconnect structure was designed and optimised using the electromagnetic simulation tool. The structure was then successfully fabricated and characterised up to 67 GHz. The measured and simulated results show good agreement, demonstrating DC-to-60 GHz broadband interconnect performance through the two levels package with return loss below 15 dB and insertion loss within 0.6 dB.|
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