Title: 60 GHz broadband Ms-to-CPW hot-via flip chip interconnects
Authors: Wu, Wei-Cheng
Hsu, Li-Han
Chang, Edward Yi
Kaernfelt, Camilla
Zirath, Herbert
Starski, J. Piotr
Wu, Yun-Chi
材料科學與工程學系
Department of Materials Science and Engineering
Keywords: coplanar waveguide (CPW);finite ground coplanar (FGC) waveguide;flip chip;hot-via;interconnect;microstrip (NIS)
Issue Date: 1-Nov-2007
Abstract: In this letter, the microstrip-to-coplanar waveguide (MS-to-CPW) hot-via flip chip interconnect has been experimentally demonstrated to have broadband performance from dc to 67 GHz. The interconnect structures with the hot-via transitions were first designed and optimized by using the electromagnetic simulation tool. Three types of designs were investigated in this letter. The interconnect structures were then fabricated and radio frequency (RF) tested up to 67 GHz. The optimized interconnect structure with the compensation design demonstrated excellent RF characteristics with the insertion loss less than 0.5 dB and the return loss below 18 dB over a very broad bandwidth from dc to 67 GHz. This is to our knowledge the best result reported for this frequency range.
URI: http://dx.doi.org/10.1109/LMWC.2007.908053
http://hdl.handle.net/11536/10188
ISSN: 1531-1309
DOI: 10.1109/LMWC.2007.908053
Journal: IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Volume: 17
Issue: 11
Begin Page: 784
End Page: 786
Appears in Collections:Articles


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