標題: 以二階式生產流程模式構建半導體封裝現場流程管制系統
A Two-Layer Manufacturing Process Model for the IC Packaging Shop Floor Control System
作者: 李榮貴
LI RONG-KWEI
交通大學工業工程與管理系
關鍵字: 二階式生產流程模式;半導體封裝業;批量流;現場流程管制系統;Two layer manufacturing process model;IC packaging industry;Batch flow;Shop floor control system
公開日期: 2000
官方說明文件#: NSC89-2213-E009-046
URI: http://hdl.handle.net/11536/101293
https://www.grb.gov.tw/search/planDetail?id=525220&docId=95517
Appears in Collections:Research Plans


Files in This Item:

  1. 892213E009046.pdf