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Issue DateTitleAuthor(s)
1-Jul-2013Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder jointsLiang, Y. C.; Lin, H. W.; Chen, H. P.; Chen, C.; Tu, K. N.; Lai, Y. S.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jul-2011The Influence of Surface Oxide on the Growth of Metal/Semiconductor NanowiresLu, Kuo-Chang; Wu, Wen-Wei; Ouyang, Hao; Lin, Yung-Chen; Huang, Yu; Wang, Chun-Wen; Wu, Zheng-Wei; Huang, Chun-Wei; Chen, Lih J.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
10-Jul-2006Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigrationLiang, S. W.; Chang, Y. W.; Shao, T. L.; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jun-2015Effect of Elastic Strain Fluctuation on Atomic Layer Growth of Epitaxial Silicide in Si Nanowires by Point Contact ReactionsChou, Yi-Chia; Tang, Wei; Chiou, Chien-Jyun; Chen, Kai; Minor, Andrew M.; Tu, K. N.; 電子物理學系; Department of Electrophysics
1-May-2010Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigrationLiang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering
2010Electromigration and Thermomigration in Pb-Free Flip-Chip Solder JointsChen, Chih; Tong, H. M.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jul-2008Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigrationLiang, S. W.; Chang, Y. W.; Chen, Chih; Preciado, Jackie; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
13-Jul-2018Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bondingTseng, Chih-Han; Tu, K. N.; Chen, Chih; 材料科學與工程學系; 國際半導體學院; Department of Materials Science and Engineering; International College of Semiconductor Technology
1-Dec-2018Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned CuJuang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
25-May-2012Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned CopperHsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering