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Issue DateTitleAuthor(s)
1-Mar-2018Low Temperature Cu-Cu Bonding Technology in Three-Dimensional Integration: An Extensive ReviewPanigrahy, Asisa Kumar; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-20183-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)Shen, Wen-Wei; Lin, Yu-Min; Chen, Shang-Chun; Chang, Hsiang-Hung; Chang, Tao-Chih; Lo, Wei-Chung; Lin, Chien-Chung; Chou, Yung-Fa; Kwai, Ding-Ming; Kao, Ming-Jer; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Feb-2018Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous IntegrationShen, Wen-Wei; Chang, Hsiao-Chun; Yang, Yu-Tao; Hu, Yu-Chen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Feb-2018Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer InterfaceHsieh, Yen-Hui; Huang, Yen-Jun; Shih, Jian-Yu; Leu, Jihperng; Chen, Kuan-Neng; 材料科學與工程學系; 電子物理學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
1-Jul-2018Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic BondingTang, Ya-Sheng; Chen, Hsiu-Chi; Kho, Yi-Tung; Hsieh, Yu-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jun-2014A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor DevicesKo, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Hsiang-Hung; Lyu, Dian-Rong; Hsu, Chao-Kai; Fu, Huan-Chun; Chien, Chun-Hsien; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Sep-2014Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration ApplicationsShih, Jian-Yu; Huang, Wen-Chun; Ko, Cheng-Ta; Yang, Zheng; Hu, Sheng-Hsiang; Leu, Jihperng; Chou, Keng C.; Chen, Kuan-Neng; 交大名義發表; 材料科學與工程學系; 電子工程學系及電子研究所; National Chiao Tung University; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
29-Aug-2014Conductivity enhancement of multiwalled carbon nanotube thin film via thermal compression methodTsai, Wan-Lin; Wang, Kuang-Yu; Chang, Yao-Jen; Li, Yu-Ren; Yang, Po-Yu; Chen, Kuan-Neng; Cheng, Huang-Chung; 交大名義發表; 電子工程學系及電子研究所; National Chiao Tung University; Department of Electronics Engineering and Institute of Electronics
1-Aug-2013Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme With Hermetic SealingShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Oct-2013Electrical Performance and Reliability Investigation of Cosputtered Cu/Ti Bonded InterconnectsChen, Hsiao-Yu; Hsu, Sheng-Yao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics