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Issue DateTitleAuthor(s)
2013在通電時錫晶粒方向與錫晶界對Cu6Sn5生成之影響林玉龍; Lin, Yu-Lung; 陳智; Chen, Chih; 材料科學與工程學系所
12-Apr-2018A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumpsChang, Yuan-Wei; Hu, Chia-chia; Peng, Hsin-Ying; Liang, Yu-Chun; Chen, Chih; Chang, Tao-chih; Zhan, Chau-Jie; Juang, Jing-Ye; 材料科學與工程學系; Department of Materials Science and Engineering
1-Aug-2009Trend transformation of drain-current degradation under drain-avalanche hot-carrier stress for CLC n-TFTsHsieh, Zhen-Ying; Wang, Mu-Chun; Chen, Chih; Shieh, Jia-Min; Lin, Yu-Ting; Chen, Shuang-Yuan; Huang, Heng-Sheng; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2009Effect of bump size on current density and temperature distributions in flip-chip solder jointsKuan, Wei-Chih; Liang, S. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jun-2008The effect of pre-aging on the electromigration of flip-chip SnAg solder jointsYang, Po-Chun; Kuo, Chien-Chih; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Apr-2011Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder jointsChen, Hsiao-Yun; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2007Relieving hot-spot temperature during electromigration in solder and current crowding effects bumps by using Cu columnsLiang, S. W.; Chang, Y. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jun-2011Magnetostructural phase transition in electroless-plated Ni nanoarraysHuang, Chun-Chao; Lo, Chih-Chieh; Tseng, Yuan-Chieh; Liu, Chien-Min; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
15-Oct-2014Grain growth in electroplated (111)-oriented nanotwinned CuHuang, Yi-Sa; Liu, Chien-Min; Chiu, Wei-Lan; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Feb-2008Effect of polyethylene glycol additives on pulse electroplating of SnAg solderChen, Hsiao-Yun; Chen, Chih; Wu, Pu-Wei; Shieh, Jia-Min; Cheng, Shing-Song; Hensen, Karl; 材料科學與工程學系; Department of Materials Science and Engineering