Browsing by Author Yu, Ting-Yang

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Showing results 1 to 12 of 12
Issue DateTitleAuthor(s)
2016Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique for 3D IntegrationLiang, Hao-Wen; Yu, Ting-Yang; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Aug-2018Asymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-Thin Buffer LayerYu, Ting-Yang; Liang, Hag-Wen; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Asymmetry Hybrid Bonding Using Cu/Sn Bonding with Polyimide for 3D Heterogeneous Integration ApplicationsHuang, Yen-Jun; Chen, Hsiu-Chi; Yu, Ting-Yang; Lai, Bo-Hung; Shih, Yu-Chiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous IntegrationYang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration ApplicationsChen, Hsiu-Chi; Kho, Yi-Tung; Huang, Yen-Jun; Hsieh, Yu-Sheng; Chang, Yao-Jen; Tang, Ya-Sheng; Yu, Ting-Yang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017High Transmittance and Broaden Bandwidth through the Morphology of Anti-Reflective Layers on THz Polarizer with Si SubstrateChi, Nai-Chen; Yu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Chen, Kuan-Neng; 電子物理學系; 電子工程學系及電子研究所; 奈米科學及工程學士學位學程; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics; Undergraduate Honors Program of Nano Science and Engineering
1-Jan-2017High Transmittance Broadband THz Polarizer Using 3D-IC TechnologiesChi, Nai-Chen; Yu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Yang, Yu-Tao; Chen, Kuan-Neng; 電機學院; 電子工程學系及電子研究所; College of Electrical and Computer Engineering; Department of Electronics Engineering and Institute of Electronics
1-Jan-2015High Transmittance Silicon Terahertz Polarizer Using Wafer Bonding TechnologyYu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Chen, Kuan-Neng; 電子物理學系; 電子工程學系及電子研究所; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
1-Sep-2017Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous IntegrationYang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Chang, Yu-Wei; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Dec-2017Robust terahertz polarizers with high transmittance at selected frequencies through Si wafer bonding technologiesYu, Ting-Yang; Chi, Nai-Chen; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Chen, Kuan-Neng; 電子物理學系; 電子工程學系及電子研究所; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
1-Jan-2018Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging SystemsPan, Yu-Ming; Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level PackageKo, Cheng-Ta; Yang, Kai-Ming; Lin, Jim-Wein; Wang, Chih-Lun; Chou, Tzu-Chieh; Yang, Yu-Tao; Yu, Ting-Yang; Chen, Yu-Hua; Chen, Kuan-Neng; Tseng, Tzyy-Jang; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics