Browsing by Author Wang, MT

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Showing results 1 to 16 of 16
Issue DateTitleAuthor(s)
1-Feb-1999Barrier capabilities of selective chemical vapor deposited W films and WSiN/WSix/W stacked layers against Cu diffusionWang, MT; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-1998Barrier properties of very thin Ta and TaN layers against copper diffusionWang, MT; Lin, YC; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-Oct-1997Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
-Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
-Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-Oct-1997Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-2006Development and deployment of public transport policy and planning in TaiwanLan, LW; Wang, MT; Kuo, AY; 運輸與物流管理系 註:原交通所+運管所; Department of Transportation and Logistics Management
1-Apr-1999Effective improvement on barrier capability of chemical vapor deposited WSix using N-2 plasma treatmentWang, MT; Lin, YC; Wang, CC; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2000Effects of composition and N-2 plasma treatment on the barrier effectiveness of chemically vapor deposited WSix filmsWang, MT; Chuang, MH; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
31-Oct-1997Effects of corrosion environments on the surface finishing of copper chemical mechanical polishingWang, MT; Tsai, MS; Liu, C; Tseng, WT; Chang, TC; Chen, LJ; Cheng, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2004Investigation of programmed charge lateral spread in a two-bit storage nitride flash memory cell by using a charge pumping techniqueGu, SH; Wang, MT; Chan, CT; Zous, NK; Yeh, CC; Tsai, WJ; Lu, TC; Wang, TH; Ku, J; Lu, CY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-1999Properties and thermal stability of chemically vapor deposited W-rich WSix thin filmsWang, MT; Lin, YC; Chuang, MS; Chun, MC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2005Stress migration and electromigration improvement for copper dual damascene interconnectionWang, TC; Hsieh, TE; Wang, MT; Su, DS; Chang, CH; Wang, YL; Lee, JYM; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jul-1998Thermal stability of selective chemical vapor deposited tungsten contact and effects of in situ N-2 plasma treatmentWang, MT; Wang, PC; Chuang, MC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Dec-1998Thin-film properties and barrier effectiveness of chemically vapor deposited amorphous WSix filmWang, MT; Lin, YC; Lee, JY; Wang, CC; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2006A versatile QCM matrix system for online and high-throughput bio-sensingHuang, GS; Wang, MT; Hong, MY; 材料科學與工程學系奈米科技碩博班; Graduate Program of Nanotechnology , Department of Materials Science and Engineering