Browsing by Author Tsai, MS

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Issue DateTitleAuthor(s)
15-Nov-2003The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layerChiu, SY; Wang, YL; Liu, CP; Lan, JK; Ay, C; Feng, MS; Tsai, MS; Dai, BT; 材料科學與工程學系; Department of Materials Science and Engineering
30-Oct-1997Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
-Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
-Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-Oct-1997Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-1997Chemical-mechanical polishing and material characteristics of plasma-enhanced chemically vapor deposited fluorinated oxide thin filmsTseng, WT; Hsieh, YT; Lin, CF; Tsai, MS; Feng, MS; 材料科學與工程學系; 奈米中心; Department of Materials Science and Engineering; Nano Facility Center
31-Oct-1997Chemical-mechanical polishing of low-dielectric-constant spin-on-glasses: film chemistries, slurry formulation and polish selectivityWang, YL; Liu, C; Chang, ST; Tsai, MS; Feng, MS; Tseng, WT; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Aug-1998Conduction mechanism and temperature-dependent current-voltage in (Ba, Sr)TiO3 thin filmsTsai, MS; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
21-May-2000Dielectric relaxation and defect analysis of Ta2O5 thin filmsEzhilvalavan, S; Tsai, MS; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Feb-1999Effect of bottom electrode materials and annealing treatments on the electrical characteristics of Ba0.47Sr0.53TiO3 film capacitorsTsai, MS; Sun, SC; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Sep-1999Effect of bottom electrode materials on the electrical and reliability characteristics of (Ba, Sr)TiO3 capacitorsTsai, MS; Sun, SC; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Nov-1998Effect of bottom electrodes on dielectric relaxation and defect analysis of (Ba0.47Sr0.53)TiO3 thin film capacitorsTsai, MS; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Nov-1998Effect of bottom electrodes on dielectric relaxation and defect analysis of (Ba0.47Sr0.53)TiO3 thin film capacitorsTsai, MS; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-2000Effect of bottom electrodes on resistance degradation and breakdown of (Ba, Sr)TiO3 thin filmsTsai, MS; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
7-Sep-1999Effect of oxygen to argon ratio on defects and electrical conductivities in Ba0.47Sr0.53TiO3 thin-film capacitorsTsai, MS; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Oct-1997Effect of oxygen to argon ratio on properties of (Ba,Sr)TiO3 thin films prepared by radio-frequency magnetron sputteringTsai, MS; Sun, SC; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
22-Aug-2000The effect of oxygen-to-argon ratio on the electrical and reliability characteristics of sputtered Sr0.8Bi2.5Ta1.2Nb0.9O9+x thin filmsTsai, MS; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2006Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishingFang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
31-Oct-1997Effects of corrosion environments on the surface finishing of copper chemical mechanical polishingWang, MT; Tsai, MS; Liu, C; Tseng, WT; Chang, TC; Chen, LJ; Cheng, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-1998Electrical properties of O-2 and N-2 annealed (Ba,Sr)TiO3 thin filmsTsai, MS; Sun, SC; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics