瀏覽 的方式: 作者 Liang, S. W.

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公開日期標題作者
1-五月-2010Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigrationLiang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering
1-八月-2008Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopyHsiao, Hsiang-Yao; Liang, S. W.; Ku, Min-Feng; Chen, Chih; Yao, Da-Jeng; 材料科學與工程學系; Department of Materials Science and Engineering
19-二月-2007Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder jointsLiang, S. W.; Chiu, S. H.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2010Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder JointsLiang, S. W.; Hsiao, H. Y.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2009Effect of bump size on current density and temperature distributions in flip-chip solder jointsKuan, Wei-Chih; Liang, S. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-七月-2008Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigrationLiang, S. W.; Chang, Y. W.; Chen, Chih; Preciado, Jackie; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2009Effect of Passivation Opening Design on Electromigration Reliability Issue in Flip-Chip Solder JointsChen, Tzu Yu; Liang, S. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
10-七月-2006Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigrationLiang, S. W.; Chang, Y. W.; Shao, T. L.; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2007Effects of current crowding and Joule heating on reliability of solder jointsLiang, S. W.; Chiu, S. H.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2012Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface FinishChu, Ming-Hui; Liang, S. W.; Chen, Chih; Huang, Annie T.; 材料科學與工程學系; Department of Materials Science and Engineering
1-三月-2007Electromigration issues in lead-free solder jointsChen, Chih; Liang, S. W.; 材料科學與工程學系; Department of Materials Science and Engineering
1-八月-2006Geometrical effect of bump resistance for flip-clip solder joints: Finite-element modeling and experimental resultsLiang, S. W.; Chang, Y. W.; Chen, Chih; Liu, Y. C.; Chen, K. H.; Lin, S. H.; 材料科學與工程學系; Department of Materials Science and Engineering
2006Joule heating effect under accelerated electromigration in flip-chip solder jointsChiu, S. H.; Liang, S. W.; Chen, Chili; Yao, D. J.; 材料科學與工程學系; Department of Materials Science and Engineering
1-十二月-2009Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder JointsLiang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering
2009Optima Design of Contact Opening for Relieving Current Crowding Effect in Flip-Chip Solder JointsLiang, S. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2007Relieving hot-spot temperature during electromigration in solder and current crowding effects bumps by using Cu columnsLiang, S. W.; Chang, Y. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
17-七月-2006Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probesChang, Y. W.; Liang, S. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2007Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testingLiang, S. W.; Chang, Y. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering