Browsing by Author Lai, Yi-Shao

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Showing results 1 to 18 of 18
Issue DateTitleAuthor(s)
1-May-2010Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigrationLiang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2008Characteristics of ZnO thin films prepared by radio frequency magnetron sputteringYang, Ping-Feng; Wen, Hua-Chiang; Jian, Sheng-Rui; Lai, Yi-Shao; Wu, Sean; Chen, Rong-Sheng; 機械工程學系; Department of Mechanical Engineering
1-Feb-2008Cross-sectional transmission electron microscopy observations of structural damage in Al(0.16)Ga(0.84)N thin film under contact loadingJian, Sheng-Rui; Juang, Jenh-Yih; Lai, Yi-Shao; 電子物理學系; Department of Electrophysics
7-Jul-2007Cross-sectional transmission electron microscopy observations on the Berkovich indentation-induced deformation microstructures in GaN thin filmsChien, Chi-Hui; Jian, Sheng-Rui; Wang, Chung-Ting; Juang, Jenh-Yih; Huang, J. C.; Lai, Yi-Shao; 電子物理學系; Department of Electrophysics
1-Jun-2010Effect of annealing treatment and nanomechanical properties for multilayer Si(0.8)Ge(0.2)-Si filmsHe, Bo-Ching; Wen, Hua-Chiang; Lin, Meng-Hung; Lai, Yi-Shao; Wu, Wen-Fa; Chou, Chang-Pin; 機械工程學系; Department of Mechanical Engineering
30-Sep-2007The effects of hydrogen plasma pretreatment on the formation of vertically aligned carbon nanotubesWang, Wen-Pin; Wen, Hua-Chiang; Jian, Sheng-Rui; Juang, Jenh-Yih; Lai, Yi-Shao; Tsai, Chien-Huang; Wu, Wen-Fa; Chen, Kuan-Ting; Chou, Chang-Pin; 機械工程學系; 電子物理學系; Department of Mechanical Engineering; Department of Electrophysics
1-Dec-2011Evaluating nanotribological behavior of annealing Si(0.8)Ge(0.2)/Si filmsWu, Ming-Jhang; Wen, Hua-Chiang; Wu, Shyh-Chi; Yang, Ping-Feng; Lai, Yi-Shao; Hsu, Wen-Kuang; Wu, Wen-Fa; Chou, Chang-Pin; 機械工程學系; Department of Mechanical Engineering
1-Jan-2010Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrateHe, Bo-Ching; Cheng, Chun-Hu; Wen, Hua-Chiang; Lai, Yi-Shao; Yang, Ping-Feng; Lin, Meng-Hung; Wu, Wen-Fa; Chou, Chang-Pin; 機械工程學系; 電子工程學系及電子研究所; Department of Mechanical Engineering; Department of Electronics Engineering and Institute of Electronics
15-Feb-2012Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder jointsLiang, Y. C.; Tsao, W. A.; Chen, Chih; Yao, Da-Jeng; Huang, Annie T.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering
15-Jun-2008Mechanical properties of InGaN thin films deposited by metal-organic chemical vapor depositionJian, Sheng-Rui; Jang, Jason Shian-Ching; Lai, Yi-Shao; Yang, Ping-Feng; Yang, Chu-Shou; Wen, Hua-Chiang; Tsai, Chien-Huang; 電子物理學系; Department of Electrophysics
22-Oct-2010Mechanical properties of the hexagonal HoMnO(3) thin films by nanoindentationYen, Cheng-Yo; Jian, Sheng-Rui; Lai, Yi-Shao; Yang, Ping-Feng; Liao, Ying-Yen; Jang, Jason Shian-Ching; Lin, Tjung-Han; Juang, Jenh-Yih; 電子物理學系; Department of Electrophysics
8-Sep-2008Morphological, structural, and mechanical characterizations of InGaN thin films deposited by MOCVDYang, Ping-Feng; Jian, Sheng-Rui; Lai, Yi-Shao; Yang, Chu-Shou; Chen, Rong-Sheng; 電子物理學系; Department of Electrophysics
2006Nanoindentation-induced phase transformation of siliconYang, Ping-Feng; Jian, Sheng-Rui; Lai, Yi-Shao; Chen, Tsan-Hsien; Chen, Rong-Sheng; 電子物理學系; Department of Electrophysics
1-Dec-2010Nanoindentation-Induced Structural Deformation in GaN/AIN MultilayersJian, Sheng-Rui; Juang, Jenh-Yih; Chen, Nie-Chuan; Jang, Jason S. -C.; Huang, J. C.; Lai, Yi-Shao; 電子物理學系; Department of Electrophysics
15-Aug-2011Nanomechanical characteristics of annealed Si/SiGe superlatticesWu, Ming-Jhang; Wen, Hua-Chiang; Wu, Shyh-Chi; Yang, Ping-Feng; Lai, Yi-Shao; Hsu, Wen-Kuang; Wu, Wen-Fa; Chou, Chang-Pin; 機械工程學系; Department of Mechanical Engineering
1-Dec-2014Nanotribological properties of ALD-processed bilayer TiO2/ZnO filmsWang, Wun-Kai; Wen, Hua-Chiang; Cheng, Chun-Hu; Hung, Ching-Hua; Chou, Wu-Ching; Yau, Wei-Hung; Yang, Ping-Feng; Lai, Yi-Shao; 機械工程學系; 電子物理學系; Department of Mechanical Engineering; Department of Electrophysics
1-Dec-2009Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder JointsLiang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2008Surface morphological and nanomechanical properties of PLD-derived ZnO thin filmsJian, Sheng-Rui; Teng, I-Ju; Yang, Ping-Feng; Lai, Yi-Shao; Lu, Jian-Ming; Chang, Jee-Gong; Ju, Shin-Pon; 材料科學與工程學系; Department of Materials Science and Engineering