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公開日期標題作者
20153D Heterogeneous Integration Structure Based on 40 nm- and 0.18 mu m- Technology NodesHu, Yu-Chen; Lin, Chun-Pin; Hsieh, Yu-Sheng; Chang, Nien-Shyang; Gallegos, Anthony J.; Souza, Terry; Chen, Wei-Chia; Sheu, Ming-Hwa; Chang, Chien-Chi; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2017A 64-CHANNEL WIRELESS NEURAL SENSING MICROSYSTEM WITH TSV-EMBEDDED MICRO-PROBE ARRAY FOR NEURAL SIGNAL ACQUISITIONHuang, Yu-Chieh; Huang, Po-Tsang; Hu, Yu-Chen; Wu, Shang-Lin; You, Yan-Huei; Wang, Yung-Kuei; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chen, Kuan-Neng; Chuang, Ching-Te; Chiou, Jin-Chern; 生物科技學系; 電機工程學系; 電控工程研究所; 國際半導體學院; Department of Biological Science and Technology; Department of Electrical and Computer Engineering; Institute of Electrical and Control Engineering; International College of Semiconductor Technology
1-四月-2017An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing MicrosystemHu, Yu-Chen; Huang, Yu-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Chang, Hsiao-Chun; Yang, Yu-Tao; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chuang, Ching-Te; Chiou, Jin-Chern; Chen, Kuan-Neng; 生物科技學系; 電子工程學系及電子研究所; 電控工程研究所; Department of Biological Science and Technology; Department of Electronics Engineering and Institute of Electronics; Institute of Electrical and Control Engineering
1-一月-2016An Advanced 3D/2.5D Integration Packaging Approach Using Double-Self-Assembly Method with Complex Topography, and Micropin-Fin Heat Sink Interposer for Pressure Sensing SystemHu, Yu-Chen; Lin, Chun-Pin; Chang, Hsiao-Chun; Yang, Yu-Tao; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2014Advanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding StructureShih, Jian-Yu; Chen, Yen-Chi; Lee, Shih-Wei; Hu, Yu-Chen; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-八月-2013Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme With Hermetic SealingShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Development and Electrical Performance of Low Temperature Cu-Sn/In Bonding for 3D Flexible Substate IntegrationHu, Yu-Chen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2018Graphene oxide sensitizes cancer cells to chemotherapeutics by inducing early autophagy events, promoting nuclear trafficking and necrosisLin, Kuan-Chen; Lin, Mei-Wei; Hsu, Mu-Nung; Guan Yu-Chen; Chao, Yu-Chan; Tuan, Hsing-Yu; Chiang, Chi-Shiun; Hu, Yu-Chen; 生物科技學系; 分子醫學與生物工程研究所; Department of Biological Science and Technology; Institute of Molecular Medicine and Bioengineering
1-一月-2017An Implantable 128-Channel Wireless Neural-Sensing Microsystem using TSV-Embedded Dissolvable mu-Needle Array and Flexible InterposerHuang, Po-Tsang; Huang, Yu-Chieh; Wu, Shang-Lin; Hu, Yu-Chen; Lu, Ming-Wei; Sheng, Ting-Wei; Chang, Fung-Kai; Lin, Chun-Pin; Chang, Nien-Shang; Chen, Hung-Lieh; Chen, Chi-Shi; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chen, Kuan-Neng; Chuang, Ching-Te; Chiou, Jin-Chern; 生物科技學系; 電子工程學系及電子研究所; 電控工程研究所; 國際半導體學院; Department of Biological Science and Technology; Department of Electronics Engineering and Institute of Electronics; Institute of Electrical and Control Engineering; International College of Semiconductor Technology
2016Integration of Neural Sensing Microsystem with TSV-embedded Dissolvable mu-Needles Array, Biocompatible Flexible Interposer, and Neural Recording CircuitsHuang, Yu-Chieh; Hu, Yu-Chen; Huang, Po-Tsang; Wu, Shang-Lin; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Chang, Hsiao-Chun; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chuang, Ching-Te; Chiou, Jin-Chern; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
2012Investigation of ICP Parameters for Smooth TSVs and Following Cu Plating Process in 3D IntegrationChiang, Cheng-Hao; Hu, Yu-Chen; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2012Micro-masking Removal of TSV and Cavity during ICP Etching Using Parameter Control in 3D and MEMS IntegrationsHu, Yu-Chen; Chiang, Cheng-Hao; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
七月-2016A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate IntegrationHu, Yu-Chen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十二月-2015A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electroless Plating on Chips With Advanced Technology NodeHu, Yu-Chen; Lin, Chun-Pin; Chang, Yao-Jen; Chang, Nien-Shyang; Sheu, Ming-Hwa; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2016Reliability Investigation and Mechanism Analysis for a Novel Bonding Method of Flexible Substrate in 3D IntegrationYang, Yu-Tao; Hu, Yu-Chen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2014Research of Electroplating and Electroless Plating for Low Temperature Bonding in 3D Heterogeneous IntegrationHu, Yu-Chen; Chang, Yao-Jen; Wu, Chun-Shen; Cheng, Yung Mao; Chen, Wei Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-五月-2013Sealing Bump With Bottom-Up Cu TSV Plating Fabrication in 3-D Integration SchemeChiang, Cheng-Hao; Kuo, Li-Min; Hu, Yu-Chen; Huang, Wen-Chun; Ko, Cheng-Ta; Chen, Kuan-Neng; 電子物理學系; 電子工程學系及電子研究所; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
2013TSV-Based Quartz Crystal Resonator Using 3D Integration and Si Packaging TechnologiesShih, Jian-Yu; Chen, Yen-Chi; Chiang, Cheng-Hao; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十月-2017Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural ProbesHuang, Yu-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Hu, Yu-Chen; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Chang, Hsiao-Chun; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chen, Kuan-Neng; Chuang, Ching-Te; Chiou, Jin-Chern; 生物科技學系; 電子工程學系及電子研究所; 電機工程學系; 電控工程研究所; Department of Biological Science and Technology; Department of Electronics Engineering and Institute of Electronics; Department of Electrical and Computer Engineering; Institute of Electrical and Control Engineering
1-二月-2018Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous IntegrationShen, Wen-Wei; Chang, Hsiao-Chun; Yang, Yu-Tao; Hu, Yu-Chen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics