Browsing by Author Chen, Yu-Hua

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Showing results 1 to 9 of 9
Issue DateTitleAuthor(s)
1-Jan-2017Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous IntegrationYang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2019Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level PackageYang, Kai-Ming; Chou, Tzu-Chieh; Ko, Cheng-Ta; Lin, Chen-Hao; Chen, Yu-Hua; Tseng, Tzyy-Jang; Wu, Wen-Wei; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
1-Sep-2017Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous IntegrationYang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Chang, Yu-Wei; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2019An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration ApplicationsLin, Yu-Min; Wu, Sheng-Tsai; Wang, Chun-Min; Lee, Chia-Hsin; Huang, Shin-Yi; Lin, Ang-Ying; Chang, Tao-Chih; Lin, Puru Bruce; Ko, Cheng-Ta; Chen, Yu-Hua; Su, Jay; Liu, Xiao; Prenger, Luke; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
1-Jan-2018Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging SystemsPan, Yu-Ming; Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2013A study on airlines' differentiated cargo service strategiesHsu, Chaug-Ing; Chen, Yu-Hua; Chen, Wei-Ting; 運輸與物流管理系 註:原交通所+運管所; Department of Transportation and Logistics Management
1-Jan-2017Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level PackageKo, Cheng-Ta; Yang, Kai-Ming; Lin, Jim-Wein; Wang, Chih-Lun; Chou, Tzu-Chieh; Yang, Yu-Tao; Yu, Ting-Yang; Chen, Yu-Hua; Chen, Kuan-Neng; Tseng, Tzyy-Jang; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jun-2012A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory ApplicationKo, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2010階層性和模組化的泛用型媒體存取控制擬真器平台設計陳裕華; Chen, Yu-Hua; 黃經堯; Huang, Ching-Yao; 電子研究所