Browsing by Author Chen, Kuan-Neng

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:  
Showing results 1 to 20 of 151  next >
Issue DateTitleAuthor(s)
1-Jan-20142.5D Heterogeneously Integrated Bio-Sensing Microsystem for Multi-Channel Neural-Sensing ApplicationsHuang, Po-Tsang; Chou, Lei-Chun; Huang, Teng-Chieh; Wu, Shang-Lin; Wang, Tang-Shuan; Lin, Yu-Rou; Cheng, Chuan-An; Shen, Wen-Wei; Chen, Kuan-Neng; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Cheng, Ming-Hsiang; Lin, Yueh-Lung; Tong, Ho-Ming; 交大名義發表; National Chiao Tung University
1-Dec-20142.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing ApplicationsHuang, Po-Tsang; Wu, Shang-Lin; Huang, Yu-Chieh; Chou, Lei-Chun; Huang, Teng-Chieh; Wang, Tang-Hsuan; Lin, Yu-Rou; Cheng, Chuan-An; Shen, Wen-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Chiou, Jin-Chern; Hwang, Wei; Tong, Ho-Ming; 交大名義發表; National Chiao Tung University
1-Jan-20183-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)Shen, Wen-Wei; Lin, Yu-Min; Chen, Shang-Chun; Chang, Hsiang-Hung; Chang, Tao-Chih; Lo, Wei-Chung; Lin, Chien-Chung; Chou, Yung-Fa; Kwai, Ding-Ming; Kao, Ming-Jer; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
20153D Heterogeneous Integration Structure Based on 40 nm- and 0.18 mu m- Technology NodesHu, Yu-Chen; Lin, Chun-Pin; Hsieh, Yu-Sheng; Chang, Nien-Shyang; Gallegos, Anthony J.; Souza, Terry; Chen, Wei-Chia; Sheu, Ming-Hwa; Chang, Chien-Chi; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017A 64-CHANNEL WIRELESS NEURAL SENSING MICROSYSTEM WITH TSV-EMBEDDED MICRO-PROBE ARRAY FOR NEURAL SIGNAL ACQUISITIONHuang, Yu-Chieh; Huang, Po-Tsang; Hu, Yu-Chen; Wu, Shang-Lin; You, Yan-Huei; Wang, Yung-Kuei; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chen, Kuan-Neng; Chuang, Ching-Te; Chiou, Jin-Chern; 生物科技學系; 電機工程學系; 電控工程研究所; 國際半導體學院; Department of Biological Science and Technology; Department of Electrical and Computer Engineering; Institute of Electrical and Control Engineering; International College of Semiconductor Technology
1-Mar-2019Adhesion and Material Properties Between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3-D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Sep-2014Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration ApplicationsShih, Jian-Yu; Huang, Wen-Chun; Ko, Cheng-Ta; Yang, Zheng; Hu, Sheng-Hsiang; Leu, Jihperng; Chou, Keng C.; Chen, Kuan-Neng; 交大名義發表; 材料科學與工程學系; 電子工程學系及電子研究所; National Chiao Tung University; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
Jul-2016Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer DielectricHuang, Yen-Jun; Hsieh, Yen-Hui; Shih, Jian-Yu; Chen, Han-Chun; Leu, Jihperng; Chen, Kuan-Neng; 材料科學與工程學系; 電子物理學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
1-Mar-2012Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D IntegrationChen, Kuan-Neng; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Fu, Huan-Chun; Lo, Wei-Chung; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Apr-2017An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing MicrosystemHu, Yu-Chen; Huang, Yu-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Chang, Hsiao-Chun; Yang, Yu-Tao; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chuang, Ching-Te; Chiou, Jin-Chern; Chen, Kuan-Neng; 生物科技學系; 電子工程學系及電子研究所; 電控工程研究所; Department of Biological Science and Technology; Department of Electronics Engineering and Institute of Electronics; Institute of Electrical and Control Engineering
1-Jan-2016An Advanced 3D/2.5D Integration Packaging Approach Using Double-Self-Assembly Method with Complex Topography, and Micropin-Fin Heat Sink Interposer for Pressure Sensing SystemHu, Yu-Chen; Lin, Chun-Pin; Chang, Hsiao-Chun; Yang, Yu-Tao; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2014Advanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding StructureShih, Jian-Yu; Chen, Yen-Chi; Lee, Shih-Wei; Hu, Yu-Chen; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Aug-2013Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme With Hermetic SealingShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2013Al2O3 Interface Engineering of Germanium Epitaxial Layer Grown Directly on SiliconTan, Yew Heng; Yew, Kwang Sing; Lee, Kwang Hong; Chang, Yao-Jen; Chen, Kuan-Neng; Ang, Diing Shenp; Fitzgerald, Eugene A.; Tan, Chuan Seng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Area-Power-Efficient 11-Bit SAR ADC with Delay-Line Enhanced Tuning for Neural Sensing ApplicationsHuang, Teng-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Chen, Kuan-Neng; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique for 3D IntegrationLiang, Hao-Wen; Yu, Ting-Yang; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Aug-2018Asymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-Thin Buffer LayerYu, Ting-Yang; Liang, Hag-Wen; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2019Asymmetric Wafer-Level Polyimide and Cu/Sn Hybrid Bonding for 3-D Heterogeneous IntegrationLu, Cheng-Hsien; Jhu, Shu-Yan; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Asymmetry Hybrid Bonding Using Cu/Sn Bonding with Polyimide for 3D Heterogeneous Integration ApplicationsHuang, Yen-Jun; Chen, Hsiu-Chi; Yu, Ting-Yang; Lai, Bo-Hung; Shih, Yu-Chiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-2013Backside-Process-Induced Junction Leakage and Process Improvement of Cu TSV Based on Cu/Sn and BCB Hybrid BondingChang, Yao-Jen; Ko, Cheng-Ta; Yu, Tsung-Han; Chiang, Cheng-Hao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics