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公開日期標題作者
1-一月-2016First Fully Functionalized Monolithic 3D(+) IoT Chip with 0.5 V Light-electricity Power Management, 6.8 GHz Wireless-communication VCO, and 4-layer Vertical ReRAMHsueh, Fu-Kuo; Shen, Chang-Hong; Shieh, Jia-Min; Li, Kai-Shin; Chen, Hsiu-Chih; Huang, Wen-Hsien; Wang, Hsing-Hsiang; Yang, Chih-Chao; Hsieh, Tung-Ying; Lin, Chang-Hsien; Chen, Bo-Yuan; Shiao, Yu-Shao; Huang, Guo-Wei; Wong, Oi-Ying; Chen, Po-Hung; Yeh, Wen-Kuan; 電子工程學系及電子研究所; 生醫電子轉譯研究中心; Department of Electronics Engineering and Institute of Electronics; Biomedical Electronics Translational Research Center
2015High Performance Poly Si Junctionless Transistors with Sub-5nm Conformally Doped Layers by Molecular Monolayer Doping and Microwave Incorporating CO2 Laser Annealing for 3D Stacked ICs ApplicationsLee, Yao-Jen; Cho, Ta-Chun; Sung, Po-Jung; Kao, Kuo-Hsing; Hsueh, Fu-Kuo; Hou, Fu-Ju; Chen, Po-Cheng; Chen, Hsiu-Chih; Wu, Chien-Ting; Hsu, Shu-Han; Chen, Yi-Ju; Huang, Yao-Ming; Hou, Yun-Fang; Huang, Wen-Hsien; Yang, Chih-Chao; Chen, Bo-Yuan; Lin, Kun-Lin; Chen, Min-Cheng; Shen, Chang-Hong; Huang, Guo-Wei; Huang, Kun-Ping; Current, Michael I.; Li, Yiming; Samukawa, Seiji; Wu, Wen-Fa; Shieh, Jia-Min; Chao, Tien-Sheng; Yeh, Wen-Kuan; 電子物理學系; 電機學院; Department of Electrophysics; College of Electrical and Computer Engineering
1-三月-2014Low-Temperature Microwave Annealing Processes for Future IC Fabrication-A ReviewLee, Yao-Jen; Cho, Ta-Chun; Chuang, Shang-Shiun; Hsueh, Fu-Kuo; Lu, Yu-Lun; Sung, Po-Jung; Chen, Hsiu-Chih; Current, Michael I.; Tseng, Tseung-Yuen; Chao, Tien-Sheng; Hu, Chenming; Yang, Fu-Liang; 電子物理學系; 電子工程學系及電子研究所; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics