Browsing by Author Chen, Chih

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:  
Showing results 1 to 20 of 204  next >
Issue DateTitleAuthor(s)
2017<111>奈米雙晶銅在<100>優選方向與無優選方向之銅薄膜上之晶粒成長之研究劉心咏; 陳智; Liu, Hsin-Yong; Chen, Chih; 材料科學與工程學系所
201630μm尺度下銅鎳錫銀以及銅銅錫銀微凸塊冶金反應及電遷移議題之研究林宛萱; 陳智; 林宏基; Lin, Wan-Hsuan; Chen, Chih; Lin, Hong-Ji; 工學院加速器光源科技與應用碩士學位學程
201050um CuNi/SnAg 金屬墊層覆晶銲錫凸塊之電遷移研究江詩寬; Chiang, Shih-Kuan; 陳智; Chen, Chih; 工學院半導體材料與製程設備學程
1-Jan-2013Analysis of bump resistance and current distribution of ultra-fine-pitch microbumpsChang, Y. W.; Peng, H. Y.; Yang, R. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.; Huang, Annie T.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2012Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder jointsGuo, Ming-Yung; Lin, C. K.; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2010Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigrationLiang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2007The brand-new high density "NCF=-type compliant-bumped COG" in high resolution LCDChang, Shyh-Ming; Kao, Kuo-Shu; An, Chao-Chyun; Chen, Ming-Yao; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang; Chen, Wen-Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2015Bump Resistance Change Behavior due to Cu-Sn IMCs Formation with Various Solder DiametersHsieh, Wan-Lin; Lin, Chung-Kuang; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 交大名義發表; 材料科學與工程學系; National Chiao Tung University; Department of Materials Science and Engineering
15-Nov-2006Characterization and field-emission properties of carbon nanotube arrays in nanoporous alumina template and on blank Si substrateYang, Ching-Jung; Chen, Chih; Shieh, Jia-Min; 材料科學與工程學系; Department of Materials Science and Engineering
2016Communication-Formation of Porous Cu3Sn by High-Temperature Current StressingLin, C. K.; Chen, Chih; Chu, David T.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
13-Jul-2018Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bondingTseng, Chih-Han; Tu, K. N.; Chen, Chih; 材料科學與工程學系; 國際半導體學院; Department of Materials Science and Engineering; International College of Semiconductor Technology
2013Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State AgingLiu, Tao-Chi; Huang, Yi-Sa; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2017Copper-to-Copper direct bonding on highly (111) oriented nano-twinned copper in no-vacuum ambientJuang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chang, Tao-Chih; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2012Core-Shell Ni-NiO Nano Arrays for UV Photodetection without an External BiasLiu, Chien-Min; Chen, Chih; Tseng, Yuan-Chieh; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2011Coupled microstructural and magnetic transition in Co-doped Ni nano-arraysYang, Chao-Yao; Huang, Chun-Chao; Tseng, Yuan-Chieh; Liu, Chien-Min; Chen, Chih; Lin, Hong-Ji; 材料科學與工程學系; Department of Materials Science and Engineering
2009Cu 5μm 與 Cu 5μm╱Ni 3μm 金屬墊層覆晶銲錫凸塊之電遷移研究張志忠; Chang, Chih-Chung; 陳智; 吳樸偉; Chen, Chih; Wu, Pu-Wei; 工學院半導體材料與製程設備學程
2016Cu-Sn 冶金反應通道之生成研究蔡培榕; 陳智; Thai, Pei-Jung; Chen, Chih; 工學院半導體材料與製程設備學程
2012The Differences in Optical Characteristics of TiO2 and TiO2/AAO Nanotube Arrays Fabricated by Atomic Layer DepositionChang, Yung-Huang; Liu, Chien-Min; Chen, Chih; Cheng, Hsyi-En; Lu, Tien-Chang; 材料科學與工程學系; 光電工程學系; Department of Materials Science and Engineering; Department of Photonics
1-Aug-2008Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopyHsiao, Hsiang-Yao; Liang, S. W.; Ku, Min-Feng; Chen, Chih; Yao, Da-Jeng; 材料科學與工程學系; Department of Materials Science and Engineering
2009Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopyLiang, You-Chun; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering