瀏覽 的方式: 作者 Chang, Yao-Jen

跳到: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
或是輸入前幾個字:  
顯示 1 到 20 筆資料,總共 26 筆  下一頁 >
公開日期標題作者
1-六月-2010Action Research as a Bridge Between Two Worlds: Helping The NGOs and Humanitarian Agencies Adapt Technology to Their NeedsChang, Yao-Jen; Liao, Rui-Hua; Wang, Tsen-Yung; Chang, Yao-Sheng; 經營管理研究所; Institute of Business and Management
1-一月-2013Al2O3 Interface Engineering of Germanium Epitaxial Layer Grown Directly on SiliconTan, Yew Heng; Yew, Kwang Sing; Lee, Kwang Hong; Chang, Yao-Jen; Chen, Kuan-Neng; Ang, Diing Shenp; Fitzgerald, Eugene A.; Tan, Chuan Seng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique for 3D IntegrationLiang, Hao-Wen; Yu, Ting-Yang; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-八月-2018Asymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-Thin Buffer LayerYu, Ting-Yang; Liang, Hag-Wen; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2013Backside-Process-Induced Junction Leakage and Process Improvement of Cu TSV Based on Cu/Sn and BCB Hybrid BondingChang, Yao-Jen; Ko, Cheng-Ta; Yu, Tsung-Han; Chiang, Cheng-Hao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2008A Bayesian hierarchical detection framework for parking space detectionHuang, Ching-Chun; Wang, Sheng-Jyh; Chang, Yao-Jen; Chen, Tsuhan; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
29-八月-2014Conductivity enhancement of multiwalled carbon nanotube thin film via thermal compression methodTsai, Wan-Lin; Wang, Kuang-Yu; Chang, Yao-Jen; Li, Yu-Ren; Yang, Po-Yu; Chen, Kuan-Neng; Cheng, Huang-Chung; 交大名義發表; 電子工程學系及電子研究所; National Chiao Tung University; Department of Electronics Engineering and Institute of Electronics
2015Development and Electrical Investigation of Novel Fine-Pitch Cu/Sn Pad Bumping Using Ultra-Thin Buffer Layer Technique in 3D IntegrationHsieh, Yu-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng; 電機學院; College of Electrical and Computer Engineering
1-一月-2017Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration ApplicationsChen, Hsiu-Chi; Kho, Yi-Tung; Huang, Yen-Jun; Hsieh, Yu-Sheng; Chang, Yao-Jen; Tang, Ya-Sheng; Yu, Ting-Yang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2013Electrical and Reliability Investigation of Cu TSVs With Low-Temperature Cu/Sn and BCB Hybrid Bond SchemeChang, Yao-Jen; Ko, Cheng-Ta; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid BondingChang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十月-2018Erbium-doped fiber dual-ring laser with stable single-longitudinal-mode and 55-nm tuning rangeYeh, Chien-Hung; Yang, Zi-Qing; Huang, Tzu-Jung; Chow, Chi-Wai; Chang, Yao-Jen; Chen, Mei-Jun; 光電工程學系; Department of Photonics
2014Interdiffusion of Cu-Sn System with Ni Ultra-thin Buffer Layer and Material Analysis of IMC Growth MechanismFan, Cheng-Han; Chang, Yao-Jen; Chou, Yi-Chia; Chen, Kuan-Neng; 電子物理學系; 電子工程學系及電子研究所; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
1-七月-2018Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic BondingTang, Ya-Sheng; Chen, Hsiu-Chi; Kho, Yi-Tung; Hsieh, Yu-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十一月-2017Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders JointsTang, Ya-Sheng; Derakhshandeh, Jaber; Kho, Yi-Tung; Chang, Yao-Jen; Slabbekoorn, John; De Preter, Inge; Vanstreels, Kris; Rebibis, Kenneth June; Beyne, Eric; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-七月-2011Investigation of Organizational Interaction and Support in an NGO through Computer-Mediated DiscussionsChang, Yao-Jen; Chang, Yao-Sheng; 經營管理研究所; Institute of Business and Management
1-十二月-2015A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electroless Plating on Chips With Advanced Technology NodeHu, Yu-Chen; Lin, Chun-Pin; Chang, Yao-Jen; Chang, Nien-Shyang; Sheu, Ming-Hwa; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015Quality and Reliability Investigation of Ni/Sn Transient Liquid Phase Bonding TechnologyTsai, Tsung-Yen; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2014Research of Electroplating and Electroless Plating for Low Temperature Bonding in 3D Heterogeneous IntegrationHu, Yu-Chen; Chang, Yao-Jen; Wu, Chun-Shen; Cheng, Yung Mao; Chen, Wei Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十一月-2014Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC ApplicationChang, Yao-Jen; Hsieh, Yu-Sheng; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics