Browsing by Author Chang, Y. W.

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Issue DateTitleAuthor(s)
20064-GHz fully monolithic SiGe HBT QVCO using superharmonic coupling topologyTseng, S. C.; Meng, C. C.; Chang, Y. W.; Huang, G. W.; 電信工程研究所; Institute of Communications Engineering
20064-GHz low-phase-noise transformer-based top-series GaInP/GaAs HBT QVCOMeng, C. C.; Tseng, S. C.; Chang, Y. W.; Su, J. Y.; Huang, G. W.; 電信工程研究所; Institute of Communications Engineering
21-Jun-20079.5 GHz GaInP/GaAs HBT divide-by-two frequency divider using super-dynamic D-type flip-flop techniqueWei, H.-J.; Meng, C.; Chang, Y. W.; Huang, G.-W; 電信工程研究所; Institute of Communications Engineering
1-Jan-2013Analysis of bump resistance and current distribution of ultra-fine-pitch microbumpsChang, Y. W.; Peng, H. Y.; Yang, R. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.; Huang, Annie T.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Apr-2007C-band fully integrated SiGe HBT superharmonic QVCOTseng, S. C.; Meng, C. C.; Chang, Y. W.; Huang, G. W.; 電信工程研究所; Institute of Communications Engineering
2007Characterization and Monte Carlo analysis of secondary electrons induced program disturb in a buried diffusion bit-line SONOS flash memoryTang, Chun-Jung; Li, C. W.; Wang, Tahui; Gu, S. H.; Chen, P. C.; Chang, Y. W.; Lu, T. C.; Lu, W. P.; Chen, K. C.; Lu, Chih-Yuan; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2008Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigrationLiang, S. W.; Chang, Y. W.; Chen, Chih; Preciado, Jackie; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
16-May-2011Effect of Si-die dimensions on electromigration failure time of flip-chip solder jointsChang, Y. W.; Chiu, S. H.; Chen, Chih; Yao, D. J.; 材料科學與工程學系; Department of Materials Science and Engineering
10-Jul-2006Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigrationLiang, S. W.; Chang, Y. W.; Shao, T. L.; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
24-Sep-2007Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structureChang, Y. W.; Chiang, T. H.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
15-Dec-2014Fast phase transformation due to electromigration of 18 mu m microbumps in three-dimensional integrated-circuit integrationChang, Y. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.; Huang, Annie T.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Aug-2006Geometrical effect of bump resistance for flip-clip solder joints: Finite-element modeling and experimental resultsLiang, S. W.; Chang, Y. W.; Chen, Chih; Liu, Y. C.; Chen, K. H.; Lin, S. H.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Nov-2010Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder JointsChang, Y. W.; Chiu, S. H.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2007Low-phase-noise transformer-based top-series QVCO using GaInP/GaAs HBT technologyMeng, C. C.; Tseng, S. C.; Chang, Y. W.; Su, J. Y.; Huang, G. W.; 電信工程研究所; Institute of Communications Engineering
2009Optimal Design of Passivation/UBM Openings for Reducing Current Crowding Effect Under Electromigration of Flip-chip Solder JointChang, Y. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
Aug-2016Poly-Silicon Trap Position and Pass Voltage Effects on RTN Amplitude in a Vertical NAND Flash Cell StringChou, Y. L.; Wang, Tahui; Lin, Mercator; Chang, Y. W.; Liu, Lenvis; Huang, S. W.; Tsai, W. J.; Lu, T. C.; Chen, K. C.; Lu, Chih-Yuan; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Oct-2007Relieving hot-spot temperature during electromigration in solder and current crowding effects bumps by using Cu columnsLiang, S. W.; Chang, Y. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2007Study of electromigration of flip-chip solder joints using Kelvin probesChang, Y. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
17-Jul-2006Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probesChang, Y. W.; Liang, S. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Feb-2007Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testingLiang, S. W.; Chang, Y. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering