Browsing by Author Lo, Wei-Chung

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Showing results 3 to 6 of 6 < previous 
Issue DateTitleAuthor(s)
2013Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid BondingChang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jun-2014A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor DevicesKo, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Hsiang-Hung; Lyu, Dian-Rong; Hsu, Chao-Kai; Fu, Huan-Chun; Chien, Chun-Hsien; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015Ultrathin Glass Wafer Lamination and Laser Debonding to Enable Glass Interposer FabricationShen, Wen-Wei; Chang, Hsiang-Hung; Wang, Jen-Chun; Ko, Cheng-Ta; Tsai, Leon; Wang, Bor Kai; Shorey, Aric; Lee, Alvin; Su, Jay; Bai, Dongshun; Huang, Baron; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jun-2012A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory ApplicationKo, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics