Browsing by Author Hu, JC

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Showing results 3 to 9 of 9 < previous 
Issue DateTitleAuthor(s)
1-Mar-2000Copper electroplating for future ultralarge scale integration interconnectionGau, WC; Chang, TC; Lin, YS; Hu, JC; Chen, LJ; Chang, CY; Cheng, CL; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Sep-2000Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)Gau, WC; Chang, TC; Lin, YS; Hu, JC; Chen, LJ; Chang, CY; Cheng, CL; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2000Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applicationsHu, JC; Chang, TC; Wu, CW; Chen, LJ; Hsiung, CS; Hsieh, WY; Lur, W; Yew, TR; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Feb-2000Enhancement of barrier properties in chemical vapor deposited TiN employing multi-stacked Ti/TiN structureChang, TC; Liu, PT; Yang, YL; Hu, JC; Sze, SM; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-1999Investigation on multilayered chemical vapor deposited Ti TiN films as the diffusion barriers in Cu and Al metallizationHu, JC; Chang, TC; Chen, LJ; Yang, YL; Chen, SY; Chang, CY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Sep-2005Large earthquake-triggered landslides and mountain belt erosion: The Tsaoling case, TaiwanChen, RF; Chan, YC; Angelier, J; Hu, JC; Huang, C; Chang, KJ; Shih, TY; 土木工程學系; Department of Civil Engineering
1-Jan-2000Reliability of multistacked chemical vapor deposited Ti/TiN structure as the diffusion barrier in ultralarge scale integrated metallizationLiu, PT; Chang, TC; Hu, JC; Yang, YL; Sze, SM; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics