Browsing by Author Chang, TC

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Issue DateTitleAuthor(s)
1996Anomalous selective tungsten growth by chemical vapor depositionMei, YJ; Chang, TC; Sheu, JD; Yeh, WK; Pan, FM; Chang, CY; 交大名義發表; 電子工程學系及電子研究所; National Chiao Tung University; Department of Electronics Engineering and Institute of Electronics
1-Aug-1996Atomic force microscopy study on the surface structure of oxidized porous siliconYoung, TF; Huang, IW; Yang, YL; Kuo, WC; Jiang, IM; Chang, TC; Chang, CY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
15-Feb-2003Characteristics and stress-induced degradation of laser-activated low temperature polycrystalline silicon thin-film transistorsPeng, DZ; Chang, TC; Chang, CY; Tsai, ML; Tu, CH; Liu, PT; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Oct-2000Characterization and reliability of lightly-doped-drain polysilicon thin-film transistors with oxide sidewall spacer formed by one-step selective liquid phase depositionShih, PS; Chang, TC; Huang, TY; Yeh, CF; Chang, CY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2-Nov-1998Characterization of multilayered Ti/TiN films grown by chemical vapor depositionHu, JC; Chang, TC; Chen, LJ; Yang, YL; Chang, CY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2002Characterization of porous silicate for ultra-low k dielectric applicationLiu, PT; Chang, TC; Hsu, KC; Tseng, TY; Chen, LM; Wang, CJ; Sze, SM; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
15-Jul-1999Characterization of Si1-x-yGexCy films grown by C+ implantation and subsequent pulsed laser annealingLuo, JS; Lin, WT; Chang, CY; Shih, PS; Pan, FM; Chang, TC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
31-Oct-1997Characterization of TiN film grown by low-pressure-chemical-vapor-depositionMei, YJ; Chang, TC; Hu, JC; Chen, LJ; Yang, YL; Pan, FM; Wu, WF; Ting, A; Chang, CY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-Oct-1997Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
-Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
-Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-Oct-1997Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2004CMP of low-k methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applicationsChang, TC; Tsai, TM; Liu, PT; Chen, CW; Yan, ST; Aoki, H; Chang, YC; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-Jan-2004CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applicationsChang, TC; Tsai, TM; Liu, PT; Chen, CW; Yan, ST; Aoki, H; Chang, YC; Tseng, T; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-1998Comparison of N-2 and NH3 plasma passivation effects on polycrystalline silicon thin-film transistorsLee, YS; Lin, HY; Lei, TF; Huang, TY; Chang, TC; Chang, CY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
26-Sep-2002Comparison of poly-Si films deposited by UHVCVD and LPCVD and its application for thin film transistorsPeng, DZ; Zan, HW; Shih, PS; Chang, TC; Lin, CW; Chang, CY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-2000Copper electroplating for future ultralarge scale integration interconnectionGau, WC; Chang, TC; Lin, YS; Hu, JC; Chen, LJ; Chang, CY; Cheng, CL; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Sep-2000Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)Gau, WC; Chang, TC; Lin, YS; Hu, JC; Chen, LJ; Chang, CY; Cheng, CL; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
22-Dec-2004Cu-penetration induced breakdown mechanism for a-SiCNChen, CW; Liu, PT; Chang, TC; Yang, JH; Tsai, TM; Wu, HH; Tseng, TY; 電子工程學系及電子研究所; 光電工程學系; 顯示科技研究所; Department of Electronics Engineering and Institute of Electronics; Department of Photonics; Institute of Display
1-Aug-2005Damage effect of fluorine implantation on PECVD alpha-SiOC barrier dielectricYang, FM; Chang, TC; Liu, PT; Chen, CW; Tai, YH; Lou, JC; 電子工程學系及電子研究所; 光電工程學系; 顯示科技研究所; Department of Electronics Engineering and Institute of Electronics; Department of Photonics; Institute of Display