Browsing by Author Chang, SC

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Showing results 21 to 37 of 37 < previous 
Issue DateTitleAuthor(s)
30-Jan-2004Monitor and eliminate the circular defects in HDP-STI deposition through oxynitride/oxide composite linerLan, JK; Wang, YL; Liu, CP; Lee, WH; Ay, C; Cheng, YL; Chang, SC; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jul-2004Optimization of post-N-2 treatment and undoped-Si-glass cap to improve metal wring delamination in deep submicron high-density plasma-fluorinated silica glass intermetal dielectric applicationCheng, YL; Wang, YL; Lan, JK; Wu, SA; Chang, SC; Lo, KY; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-Dec-2002Pattern effects on planarization efficiency of Cu electropolishingChang, SC; Shieh, JM; Huang, CC; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
2004Pattern-dependent copper microcorrosion from CMPChen, KW; Wang, YL; Chang, L; Chang, SC; Li, FY; Lin, SH; 材料科學與工程學系; Department of Materials Science and Engineering
1-Feb-2005A platform based bus-interleaved architecture for de-blocking filter in H.264/MPEG-4 AVCChang, SC; Peng, WH; Wang, SH; Chiang, T; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2005A platform-based de-blocking filter design with bus-interleaved architecture for H.264Chang, SC; Peng, WH; Wang, SH; Chiang, TH; 交大名義發表; National Chiao Tung University
2003A platform-based MPEG-4 Advanced Video Coding (AVC) decoder with block level pipeliningWang, SH; Peng, WH; He, YW; Lin, GY; Lin, CY; Chang, SC; Wang, CN; Chiang, TH; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jun-2002Reduction of resistivity of electroplated copper by rapid thermal annealingChang, SC; Shieh, JM; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2004Roles of copper mechanical characteristics in electropolishingChang, SC; Shieh, JM; Fang, JY; Wang, YL; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2005Soft-x-ray absorption spectroscopy of heterostructured high-T-c superconducting nanohybrids: X-Bi2Sr2CaCu2O8 [X=I, HgI2, and (Py-CH3)(2)HgI4]Chen, JM; Chang, SC; Liu, RS; Lee, JM; Park, M; Choy, JH; 電子物理學系; Department of Electrophysics
1-Aug-2005A software-hardware co-implementation of MPEG-4 Advanced Video Coding (AVC) decoder with block level pipeliningWang, SH; Peng, WH; He, YW; Lin, GY; Lin, CY; Chang, SC; Wang, CN; Chiang, T; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-Jan-2004Study on precipitations of fluorine-doped silicon oxideWu, J; Wang, YL; Liu, CP; Chang, SC; Kuo, CT; Ay, C; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2003Superpolishing for planarizing copper damascene interconnectsChang, SC; Shieh, JM; Dai, BT; Feng, MS; Li, YH; Shih, CH; Tsai, MH; Shue, SL; Liang, RS; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering
2000Technology of electroplating copper with low-K material a-C : F for 0.15 mu m damascene interconnectionShieh, JM; Suen, SC; Lin, KC; Chang, SC; Dai, BT; Chen, CF; Feng, MS; 奈米中心; Nano Facility Center
1-May-2005Using a fuzzy multi-criteria decision making approach to evaluate alternative licensing mechanismsYu, EC; Lee, ZY; Chang, SC; 科技管理研究所; Institute of Management of Technology
1-Jun-2005A variable P value rolling Grey forecasting model for Taiwan semiconductor industry productionChang, SC; Lai, HC; Yu, HC; 科技管理研究所; Institute of Management of Technology
1-Jul-2002Wetting effect on gap filling submicron damascene by an electrolyte free of levelersChang, SC; Shieh, JM; Lin, KC; Dai, BT; Wang, TC; Chen, CF; Feng, MS; Li, YH; Lu, CP; 材料科學與工程學系; Department of Materials Science and Engineering